Remote ?癈 Accurate Digital Temperature
Sensors with SPI-Compatible Serial Interface
8 _______________________________________________________________________________________
DXP
DXN
12-BIT + SIGN
ADC
V
CC
SPI
INTERFACE
SDO
SCK
CS
Functional Diagram
SCK
V
CC
1
2
8
7
N.C.
SDO
DXN
DXP
GND
SOT23
TOP VIEW
3
4
6
5
MAX6627
CS
1
+
3
4
8
6
5
N.C.
CS SCK
MAX6627
MAX6628
2
7
SDO
GND
DXP
EP
V
CC
DXN
TDFN
Pin Configurations
Chip Information
PROCESS: BiCMOS
Package Information
For the latest package outline information and land patterns
(footprints), go to www.maxim-ic.com/packages
. Note that a
+ , # , or - in the package code indicates RoHS status only.
Package drawings may show a different suffix character, but
the drawing pertains to the package regardless of RoHS status.
PACKAGE
TYPE
PACKAGE
CODE
OUTLINE
NO.
LAND
PATTERN NO.
8 SOT23
K8F#4
21-0078
90-0176
8 TDFN-EP
T833+2
21-0137
90-0059
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